Data Center Cooling Supplier Landscape
A view of who is investing in server rack and data center cooling IP, and who files globally. For sales and BD teams selling cold plates, CDUs, immersion gear, and thermal interface materials: use the ranking to see where hyperscalers, server integrators, and rack vendors are concentrating R&D, and where that activity crosses borders.
Leaders include server integrators and hyperscalers (Baidu, Quanta, Inventec, OVH, NVIDIA), showing who is engineering rack-level cooling. Useful for suppliers selling cold plates, CDUs, and thermal materials into those programs.
Top 25 by international patent families
| # | Company | HQ | Intl families | Since 2018 | Since 2023 | Filing offices | Intl share |
|---|---|---|---|---|---|---|---|
| 1 | Baidu | China | 136 | 173 | 0 | 6 | 79% |
| 2 | Quanta Computer | Taiwan | 96 | 133 | 30 | 5 | 72% |
| 3 | Inventec | Taiwan | 96 | 112 | 47 | 3 | 86% |
| 4 | OVH | France | 76 | 80 | 35 | 8 | 95% |
| 5 | NVIDIA | United States | 75 | 103 | 25 | 6 | 73% |
| 6 | Huawei | China | 66 | 96 | 25 | 9 | 69% |
| 7 | Vertiv | United States | 64 | 83 | 73 | 21 | 77% |
| 8 | Foxconn | China | 58 | 60 | 33 | 6 | 97% |
| 9 | Wistron | Taiwan | 50 | 52 | 15 | 5 | 96% |
| 10 | Suzhou Metabrain Intelligent Technology | China | 50 | 50 | 39 | 6 | 100% |
| 11 | Microsoft | United States | 45 | 64 | 26 | 13 | 70% |
| 12 | Cloud Network Technology (Singapore) | Singapore | 40 | 40 | 23 | 4 | 100% |
| 13 | Hewlett Packard Enterprise | United States | 37 | 82 | 30 | 8 | 45% |
| 14 | Intel | United States | 35 | 77 | 27 | 8 | 45% |
| 15 | Suzhou Inspur Intelligent Technology | China | 30 | 149 | 37 | 5 | 20% |
| 16 | United States | 29 | 29 | 10 | 14 | 100% | |
| 17 | Wiwynn | Taiwan | 28 | 32 | 24 | 5 | 88% |
| 18 | Suzhou Yuannao Intelligent Technology | China | 24 | 124 | 124 | 6 | 19% |
| 19 | Fujitsu | Japan | 22 | 22 | 0 | 6 | 100% |
| 20 | Delta Electronics | Taiwan | 21 | 26 | 16 | 8 | 81% |
| 21 | Iceotope Group | United Kingdom | 20 | 21 | 4 | 10 | 95% |
| 22 | Hoffman Enclosures | United States | 19 | 21 | 16 | 5 | 90% |
| 23 | Hongfujin Precision Electronics (Tianjin) | China | 19 | 20 | 0 | 5 | 95% |
| 24 | Schneider Electric IT | United States | 18 | 24 | 9 | 11 | 75% |
| 25 | Nidec | Japan | 18 | 18 | 13 | 4 | 100% |
Methodology
Patent families first filed in 2018 or later, matched on CPC or IPC codes. “International” means filed in two or more patent offices. Source is Google Patents Public Data via BigQuery.
Codes: CPC and IPC H05K7/207xx (cooling for server racks and data centers).
Companies are merged across name variants (for example, several spelling and romanization variants of the same assignee are rolled up into one row). Universities and government research bodies are excluded, so the ranking reflects commercial filers.
Rankings reflect patent activity, not revenue. A heavy filer may be protecting a research program that has not shipped, and a low filer may still be a dominant supplier.
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